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The Altium 365 Vault is where we store all component symbols and footprints used by the team. We have setup guidelines to ensure that all final PCBs have a unified and methodical layer system.

PCBs that do not follow guidelines and/or use components that do not follow guidelines, may not be release for production until guidelines are met

Currently our guidelines are still in Google Drive:

...

Additionally, the #Standards folder contains the custom NERvetica font and a pre-populated DRC file.

Welcome to the Official NER Vault Guidelines! This is the comprehensive guide on requirements for everything in Altium at NER.

The format of this guide will be very barebones as we want it to be a quick and absolute guide. Check out Altium Reference for friendlier refreshers on workflow, shortcuts, and more.

These guidelines assume you know the Altium basics and are intended to be a reference for all engineers at NER. If you need to get started with Altium check out Altium Designer!

CONTENTS

Table of Contents
minLevel1
maxLevel2
outlinefalse
typelist
printablefalse

Vault Organization

Where things go and how to name them

Info

Become familiar with our organization to ensure you put things in the right spot, allowing others to more easily find and reuse!

General Notes

  • All assets in the vault must have a name and be placed in a folder that is not the default/root

  • The more specific the folder/type the better

    • Don’t make new folders, but do make sure you aren’t picking a top level folder if there is a good match lower in the tree

  • Names should be generic if possible

    • For example the TPS5V converter that comes in a few voltages could be named TPSXX so the symbol is sharable among all versions

    • A footprint for a MOSFET that is a three pin TO-220 should just be labeled “TO-220-3” so it can be reused for other FETs and diodes, rather than a specific MPN

Components

Follows the Digikey product categories.

Since creation, Digikey has adjusted some categories. A vast majority however will still align.

Symbols

Organized by component category, with a few noteworthy omissions due to mergers. Passives for example contains the standard resistor and capacitor symbols and Mechanical contains heat sinks and mounting holes.

Footprints

Follows the Digikey product categories. Within categories, footprints are split by manufacturer for unique footprints. A large exception is made for semiconductors, as they all can share footprints. See the ICs, Semiconductors folder for these common footprints which are sorted by standards.

3D Models

Deprecated. We now embed 3D models directly into footprints.

Components

Requirements for component files. See https://nerdocs.atlassian.net/wiki/spaces/NER/pages/118718470/Vault+Guidelines#Symbols.1 and https://nerdocs.atlassian.net/wiki/spaces/NER/pages/118718470/Vault+Guidelines#Footprints.1 for the symbols and footprints you embed!

Types

A few notes on component types and templates

Always use the most specific “Type” that is applicable to your component. More specific types correspond to more specifically tailored templates that include more useful parameters.

In particular:

  • DO NOT use the “Integrated Circuits” type, unless you truly cannot find a more specific category

  • Note that within “PMIC” we have created “Voltage Regulators.” This includes LDOs and switching regulators (and any other topologies)

Selection

Manufacturability

Components should be selected with ease of manufacturing/in-house assembly in mind, namely:

  • 0603 is the smallest chip size that is hand-solderable in bulk. 0402 and smaller is possible, but frustrating

  • ICs should use legged versions when available

Environment

Components should be automotive rated (AEC-Q) when available

Recommended Series

Component

Manufacturer

Series

Capacitors

Murata

GCM

Resistors

Panasonic

ERJ, ERA

Parameters

With the adoption of Altium Pro, our parameters are now enforced via templates. Please contact the Chief EE if a template is wrong or you have suggestions for parameters to add.

...

titleView all parameters we use below

Standard Parameters

All components have these

  • Min Operating Temperature (C)

  • Max Operating Temperature (C)

Most components have

  • Case/Package

Type-Based Parameters

Parameters that are applicable based on component type

The component template will mark some as required and some as recommended. Always fill in as much as possible (without extrapolations from the data directly provided)

...

Component Type

...

Parameters

...

Welcome to the Official NER Vault Guidelines! This is the comprehensive guide on requirements for everything in Altium at NER.

The format of this guide will be very barebones as we want it to be a quick and absolute guide. Check out Altium Reference for friendlier refreshers on workflow, shortcuts, and more.

These guidelines assume you know the Altium basics and are intended to be a reference for all engineers at NER. If you need to get started with Altium check out Altium Designer!

CONTENTS

Table of Contents
minLevel1
maxLevel2
outlinefalse
typelist
printablefalse

Vault Organization

Where things go and how to name them

Info

Become familiar with our organization to ensure you put things in the right spot, allowing others to more easily find and reuse!

General Notes

  • All assets in the vault must have a name and be placed in a folder that is not the default/root

  • The more specific the folder/type the better

    • Don’t make new folders, but do make sure you aren’t picking a top level folder if there is a good match lower in the tree

  • Names should be generic if possible

    • For example the TPS5V converter that comes in a few voltages could be named TPSXX so the symbol is sharable among all versions

    • A footprint for a MOSFET that is a three pin TO-220 should just be labeled “TO-220-3” so it can be reused for other FETs and diodes, rather than a specific MPN

Components

Follows the Digikey product categories.

Since creation, Digikey has adjusted some categories. A vast majority however will still align.

Symbols

Organized by component category, with a few noteworthy omissions due to mergers. Passives for example contains the standard resistor and capacitor symbols and Mechanical contains heat sinks and mounting holes.

Footprints

Follows the Digikey product categories. Within categories, footprints are split by manufacturer for unique footprints. A large exception is made for semiconductors, as they all can share footprints. See the ICs, Semiconductors folder for these common footprints which are sorted by standards.

3D Models

Deprecated. We now embed 3D models directly into footprints.

Components

Requirements for component files. See https://nerdocs.atlassian.net/wiki/spaces/NER/pages/118718470/Vault+Guidelines#Symbols.1 and https://nerdocs.atlassian.net/wiki/spaces/NER/pages/118718470/Vault+Guidelines#Footprints.1 for the symbols and footprints you embed!

Types

A few notes on component types and templates

Always use the most specific “Type” that is applicable to your component. More specific types correspond to more specifically tailored templates that include more useful parameters.

In particular:

  • DO NOT use the “Integrated Circuits” type, unless you truly cannot find a more specific category

  • Note that within “PMIC” we have created “Voltage Regulators.” This includes LDOs and switching regulators (and any other topologies)

Selection

Manufacturability

Components should be selected with ease of manufacturing/in-house assembly in mind, namely:

  • 0603 is the smallest chip size that is hand-solderable in bulk. 0402 and smaller is possible, but frustrating

  • ICs should use legged versions when available

Environment

Components should be automotive rated (AEC-Q) when available

Recommended Series

Component

Manufacturer

Series

Capacitors

Murata

GCM

Resistors

Panasonic

ERJ, ERA

Description

The description must contain useful information. Sometimes, the Altium database will have good data, but if not, default to copying the Digikey “Detailed Description” for the part.

Parameters

With the adoption of Altium Pro, our parameters are now enforced via templates. Please contact the Chief EE if a template is wrong or you have suggestions for parameters to add.

Parameters Shown
Expand
titleView all parameters we use below
Expand
titleParameters to display

Standard Parameters

All components have these

  • Min Operating Temperature (C)

  • Max Operating Temperature (C)

Most components have

  • Case/Package

Type-Based Parameters

Parameters that are applicable based on component type

The component template will mark some as required and some as recommended. Always fill in as much as possible (without extrapolations from the data directly provided)

Component Type

Component Type

Parameters

Amplifiers

  • Min Supply Voltage (V)

  • Max Supply Voltage (V)

  • Amplifier Type

  • Number of Circuits

  • Output Type

Audio

None

Batteries

  • Mounting Type

  • Battery Type

BJTs

  • Vce Rating (V)

  • Transistor Type

  • Ic Rating (A)

  • Power Rating (W)

Capacitors

  • Capacitor Type

  • Voltage Rating (V)

  • Tolerance (%)

  • Value (F)

Chokes

  • Mounting Type

  • Number of Lines

  • Impedance @ Frequency

  • Inductance @ Frequency

  • Current Rating (A)

  • DC Resistance (Ohm)

  • Voltage Rating (V)

Clock & Timing

  • Frequency (Hz)

  • Min Supply Voltage (V)

  • Max Supply Voltage (V)

Comparators

  • Min Supply Voltage (V)

  • Max Supply Voltage (V)

  • Amplifier Comparator Type

  • Number of CircuitsElements

  • Output Type

Audio

None

Batteries

Connectors

  • Mounting Type

  • Battery Type

BJTs

  • Vce

  • Number of Contacts

  • Gender (Pin/Socket)

  • Orientation (Right/Vertical)

  • Voltage Rating (V)

  • Transistor Type

  • Ic Current Rating (A)

  • Power Rating (W)

Capacitors

  • Capacitor Type

  • Voltage Rating (V)

  • Tolerance (%)

  • Value

    Crystals & Oscillators

    • Frequency (Hz)

    • ESR (Ohm)

    • Load Capacitance (F)

    ChokesCustom

    • Mounting Type

    • Number of Lines

    • Impedance @ Frequency

    • Inductance @ Frequency

    • Current Rating

    Development Boards

    None

    Diodes

    • Forward Current (A)

    • DC Resistance Forward Voltage (OhmV)

    • Reverse Voltage Rating (V)

    Clock & Timing

    Frequency (Hz)

    Embedded

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    Comparators

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    • Comparator Type

    • Number of Elements

    Connectors

    • Mounting Type

    • Number of Contacts

    • Gender (Pin/Socket)

    • Orientation (Right/VerticalSpeed (Hz)

    • Memory Size

    • RAM Size

    Fuses

    • Current Rating (A)

    • Voltage Rating (AC) (V)

    • Voltage Rating (DC) (V)

    • Current Rating Breaking Capacity @ Rated Voltage (A)

    Crystals & Oscillators

    • Frequency (Hz)

    • ESR (Ohm)

    • Load Capacitance (F)

    Custom

    • Mounting Type

    Development Boards

    None

    Diodes

    • Forward Current (A)

    • Forward Voltage (V)

    • Reverse Voltage (V)

    Embedded

  • Min Supply Voltage (V)

  • Max

    Gate Drivers

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    Hardware

    • Hardware Size

    Heat Sinks

    • Thermal Resistance @ Natural

    • Package Cooled

    Inductors

    • Mounting Type

    • Tolerance (%)

    • Self Resonant Frequency (Hz)

    • Value (H)

    • Saturation Current (Isat) (A)

    • DC Resistance (Ohm)

    Integrated Circuits

    • Min Supply Voltage (V)

    • Speed Max Supply Voltage (HzV)

    • Memory Size

    • RAM Size

    Fuses

    • Current Rating (A)

    • Voltage Rating (AC) (V)

    • Voltage Rating (DC) (V)

    • Breaking Capacity @ Rated Voltage (A)

    Gate Drivers

    Min Supply

    Interface

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    Isolators

    • Isolation Voltage Rating (V)

    • Number of Channels

    • Isolation Type

    LED

    • Color

    • Forward Voltage (V)

    • Max Supply Voltage Power Dissipation (V)

    Hardware

    • Hardware Size

    Heat Sinks

    • Thermal Resistance @ Natural

    • Package Cooled

    Inductors

    • Mounting Type

    • Tolerance (%)

    • Self Resonant Frequency (Hz)

    • Value (H)

    • Saturation Current (Isat) W)

    • Forward Current (A)

    • DC Resistance (Ohm)

    Integrated CircuitsLogic

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    Interface

    • Min Supply Logic Type

    • Number of Circuits

    Memory

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    Isolators

    • Isolation Voltage Memory Format

    • Memory Size

    • Speed (Hz)

    MOSFETs

    • Vds Rating (V)

    • Number of Channels

    • Isolation Type

    LED

    • Color

    • Forward Voltage (V)

    • Max Power Dissipation Channel Type (N/P)

    • Ids Rating (A)

    • Power Rating (W)

    • Forward Current Rds (AOhm)

    LogicOptoisolators

    • Min Supply Isolation Voltage Rating (V)Max Supply

    • Number of Channels

    • Forward Voltage (V)

    • Logic Type

    • Number of Circuits

    Memory

    PMIC

    • Min Supply Voltage (V)

    • Max Supply Voltage (V)

    • Memory Format

    • Memory Size

    • Speed (Hz)

    MOSFETs

  • Vds Rating (V)

  • Channel Type (N/P)

  • Ids Rating (A

    Potentiometers

    • Tolerance (%)

    • Power (W)

    • Voltage Rating (V)

    • Value (Ohm)

    • Movement Type

    • Travel

    Power Supply

    • Max Input Voltage (V)

    • Min Input Voltage (V)

    • Power Rating (W)

    • Rds (Ohm)

    Optoisolators

    • Isolation Voltage Rating Min/Fix Output Voltage (V)

    • Max Output Voltage (V)

    • Number of Channels

    • Forward Voltage

    Relays

    • Mounting Type

    • Contact Form

    • Contact Current Rating (A)

    • Contact Voltage Rating (V)

    PMIC

    • Min Supply Coil Voltage (V)Max Supply Voltage (V

    • Coil Current (A)

    PotentiometersResistors

    • Tolerance (%)

    • Power (W)

    • Voltage Rating (V)

    • Value (Ohm)

    • Movement Type

    • Travel

    Power Supply

    Max Input

    Sensors

    • Min Supply Voltage (V)Min Input

    • Max Supply Voltage (V)Power

    • Sensor Type

    SSRs

    • Contact Form

    • Load Current Rating (WA)

    • Min/Fix Output Load Voltage Rating (V)Max Output

    • Input/Forward Voltage (V)

    RelaysSwitches

    • Mounting Type

    • Contact Form

    • Contact Voltage Rating (V)

    • Current Rating (A)

    • Contact Voltage Rating (V)

    • Coil

    • Throw Configuration

    • Movement Type

    Test & Measurement

    • Mounting Type

    Transformers

    • Mounting Type

    • Turns Ratio

    • Primary Inductance (H)

    • Primary Voltage (V)

    • Coil Current Secondary Voltage (AV)

    Resistors

    • Tolerance (%)

    • Power (W)

    • Voltage Rating (V)

    • Value (Ohm)

    Sensors

    Min Supply

    TVS Diodes

    • Channels

    • Directionality

    • Reverse Standoff Voltage (V)

    • Breakdown Voltage (Min) (V)

    • Clamping Voltage (Max) (V)

    • Peak Pulse Current (A)

    Voltage Regulator

    • Min Input Voltage (V)

    • Max Input Voltage (V)

    • Min/Fixed Output Voltage (V)

    • Max Supply Output Voltage (V)

    • Sensor Type

    SSRs

    • Contact Form

    • Load Current Rating (A)

    • Load Voltage Rating (V)

    • Input/Forward Voltage (V)

    Switches

    • Mounting Type

    • Voltage Rating (V)

    • Current Rating (A)

    • Throw Configuration

    • Movement Type

    Test & Measurement

    • Mounting Type

    Transformers

    • Mounting Type

    • Turns Ratio

    • Primary Inductance (H)

    • Primary Voltage (V)

    • Secondary Voltage (V)

    TVS Diodes

    • Channels

    • Directionality

    • Reverse Standoff Voltage (V)

    • Breakdown Voltage (Min) (V)

    • Clamping Voltage (Max) (V)

    • Peak Pulse Current (A)

    Voltage Regulator

    • Min Input Voltage (V)

    • Max Input Voltage (V)

    • Min/Fixed Output Voltage (V)

    • Max Output Voltage (V)

    • Output Current (A)

    Shit Parameters

    DO NOT ADD THESE. WE DON’T WANT THEM

    • Datasheets (these often go out of date, so we require pulling from online)

    • RoHS Compliant (not relevant)

    • Reach SVHC Compliant (not relevant)

    • Packaging (not relevant)

    Note

    When importing parameters, the above often are suggested. Make sure to uncheck them.

    Symbols

    ...

    Symbol Layout

    Symbols should use imperial spacing at 100 mils.

    If a more detailed symbol isn’t available, footprints should be implemented using the Altium default yellow rectangle with “small” red outline. Pins should be spaced by one 100 mil grid spacing.

    Pin designators should be hidden and pin names should exactly match the datasheet (with the exception of characters that Altium doesn’t allow).

    Pin arrangement can be either matching the physical layout or optimized for schematic routing (place pins as needed to avoid messy wires).

    Designators

    Utilize common designators for symbols. The hard-set definition we use is Appendix F of IEEE-315:

    View file
    nameIEEE-315-1975_AnnexF.pdf

    The right side column is what we utilize, when applicable.

    All designator letters should be followed by “?”, as this is the wildcard for auto-generating designators. For example “D?” for diodes, “J?” for connectors, “R?” for resistors.

    Footprints

    All layers can adjust line width to be proportional to component size. Around 5 mils / 0.15mm is often a good starting point.

    Layer Pair Setup

    The following are the required layer pairs names and numbers as well as what to put in each.

    Info

    These are all standard types. You can avoid typing them by selecting out of the dropdown first.

    Layer Type

    Top / Bottom Layer Numbers

    Contents

    Assembly

    13 / 14

    3D Model

    Component Outline

    15 / 16

    Outline of physical bounds of package, excluding legs

    Component Center

    17 / 18

    Crosshair at center of component

    Courtyard

    19 / 20

    Clearance required around component / collision box

    Dimensions

    21 / 22

    Additional details component (board edge, insertion direction & clearance, etc)

    Assembly

    • Should be a 3D model downloaded from the manufacturer or other trusted site

    • A 3D extrusion is allowable to approximate if no CAD can be found

    • Additional physical assembly details can be included if required (designator indicators or other features)

    Component Outline

    Must match the physical outline of the component. This can be traced from 3D body, if the body is accurate. If legs are present, the legs should be disregarded (only trace the plastic/ceramic body)

    Component Center

    A crosshair must be added to all components. This consists of just two lines intersecting to create plus sign.

    The component center should be placed at the center of all component pins.

    The lines should default to 30 mils / 0.8 mm. This may be decreased or increased if the component is foolishly smaller or larger than these extents.

    This can be easily found by using “Set Reference” to send the origin to “Center”

    Courtyard

    Collision box for placing components. This is a boundary that should define how much clearance is recommended between components.

    Recommended: 10 mils / 0.25 mm

    Courtyards should be defined from the physical bounds of the component and pads. Silkscreen may be outside the courtyard if desired.

    Pin 1 Designation

    Pin one is usually indicated in the datasheet. If not, select the top left or top right corner from the footprint.
    Pin one must be indicated in silkscreen. By default, this should be a circle next to pin one.

    Pin one ideally is also indicated via pads with a rectangular/square pad (with the other pads being ovular/circular).

    3D Model

    All footprints must include a 3D model.

    If manufacturer CAD is not available, add an extruded model and color it to a representative hue.

    Origin

    All layouts and footprints have an origin. This is where the coordinate system is zeroed from.

    The origin may be moved throughout the layout process but when complete must be set to either the origin of the datasheet dimensions or the center of the component.

    Schematics

    All schematic sheets must use the NER template. Tabloid is the default, but Letter size is also available.

    Info

    These are set via page properties. Click in blank space then open the properties panel. The https://nerdocs.atlassian.net/wiki/spaces/NER/pages/136314883/Schematic+Capture#Schematic-Templates page has further directions if needed.

    Organization & Hierarchy

    Projects requiring multiple sheets should implement a hierarchical structure, utilizing a block-diagram style top sheet.

    ...

    It is preferential to keep a design entirely on the top sheet, if it is small enough.

    Functional sections on all pages should then be designated using medium red dashed lines to define boxes.

    ...

    All schematics must be organized logically. This is typically either by placing in order of power and signal flow (inputs/supplies to the left, to outputs/loads on the right) or, for TS-GLV projects, by organizing according to isolation, placing all isolation barriers along a single line.

    Style Guidelines

    Schematics should default to a 100 mils grid system. The grid may be reduced for placing certain components, but components and wires must be aligned to a 100 mils grid.

    Signal Routing

    Within functional sections of the schematic, it is recommended to utilize wires to establish connections. For longer runs, or within densely connected regions, it is best to use Net Labels. Generally, wire routing just needs to be kept readable, however the designer thinks that is best achieved.

    All connections of significance should be net labeled, even if connected via wire.

    Wires must be stepped away from connections by at least 1 grid spacing (100 mils)

    {image of good and bad}

    Four way connections must be avoided.

    {image of bad and good}

    Net Labels

    Net labels should be used anywhere they make sense, both for connections and for just labeling purposes.

    Net labels should be in full caps with underscores to separate words and suffixes.

    Acronyms may be used if full name would be excessively long. A note should be added to explain acronyms if they are not self explanatory.

    Power & GND Ports

    ...

    All power nets must be implemented using power ports.

    The BAR power port must be used for all supply voltage nets. This includes positive and negative rails.

    The GND port must be used for all GLV ground/chassis connections.

    The SIGNAL ground port may be used in non-GLV ground systems. This primarily arises in isolated systems.

    Communication Busses

    Bussed signals, such as CAN, SPI, I2C, etc should utilize harnesses.

    ...

    Addressed Devices (I2C)

    Devices with addresses set in hardware must have their address stated above the component in blue text.

    ...

    Component Placement

    Components should be placed on a 100 mils grid.

    Certain parameters should be displayed for every type of component. These may be modified in certain contexts if shown data is completely irrelevant. I.e. resistors used for logic may not need to show power rating.

    If no parameters are shown, the MPN should be shown instead.

    • Output Current (A)

    Shit Parameters

    DO NOT ADD THESE. WE DON’T WANT THEM

    • Datasheets (these often go out of date, so we require pulling from online)

    • RoHS Compliant (not relevant)

    • Reach SVHC Compliant (not relevant)

    • Packaging (not relevant)

    Note

    When importing parameters, the above often are suggested. Make sure to uncheck them.

    What Value to Use

    Numerical Values

    All parameters must be filled in using values from normal/recommended operation. This means the “Absolute Max” table or values should not be used.

    If one parameter field is provided and the datasheet provides typical, min/max, and absolute min/max, think about what is most informative when searching for components for a new design. Typically, the minimum/maximum of normal range!

    Case/Package Value

    Digikey may provide multiple different values for this field. Our protocol is to first check if we have an existing footprint for the component. If so, enter the standard footprint name that was used. If not, use whichever name is most commonized (avoid manufacturer proprietary names).

    Symbols

    ...

    Symbol Layout

    Symbols should use imperial spacing at 100 mils.

    If a more detailed symbol isn’t available, footprints should be implemented using the Altium default yellow rectangle with “small” red outline. Pins should be spaced by one 100 mil grid spacing.

    Pin designators should be hidden and pin names should exactly match the datasheet (with the exception of characters that Altium doesn’t allow).

    Pin arrangement can be either matching the physical layout or optimized for schematic routing (place pins as needed to avoid messy wires).

    Designators

    Utilize common designators for symbols. The hard-set definition we use is Appendix F of IEEE-315:

    View file
    nameIEEE-315-1975_AnnexF.pdf

    The right side column is what we utilize, when applicable.

    All designator letters should be followed by “?”, as this is the wildcard for auto-generating designators. For example “D?” for diodes, “J?” for connectors, “R?” for resistors.

    ...

    Properties

    The component type must be set when applicable. This drop down allows you to define components as non-BOM items, such as mounting holes, test points, etc. We primarily use Standard, Net Tie (No BOM), and Standard (No BOM).

    The Designator must be shown, however the Comment typically is hidden. The comment field determines if the component part number will be shown by default.

    Footprints

    All footprints must be modeled such that the component is installed on the top side of the board (footprints are a top view) and such that pin 1 is towards the top left.

    All layers can adjust line width to be proportional to component size. 5 mils / 0.12mm is a good starting point.

    Layer Pair Setup

    The following are the required layer pairs names and numbers as well as what to put in each.

    Info

    These are all standard types. You can avoid typing them by selecting out of the dropdown first.

    Layer Type

    Top / Bottom Layer Numbers

    Contents

    Assembly

    13 / 14

    3D Model

    Component Outline

    15 / 16

    Outline of physical bounds of package, excluding legs

    Component Center

    17 / 18

    Crosshair at center of component

    Courtyard

    19 / 20

    Clearance required around component / collision box

    Dimensions

    21 / 22

    Additional details component (board edge, insertion direction & clearance, etc)

    As mentioned above, we recommend a line width for all primitives of 5 mils / 0.12 mm. This can be adjusted proportionally to the overall component size if desired to avoid obscuring detail.

    Assembly

    Should be a 3D model downloaded from the manufacturer or other trusted site. A 3D extrusion is allowable to approximate if no CAD can be found.

    Additional physical assembly details can be included if required (designator indicators or other assembly features). For context on what is acceptable, this is a layer that is purely used for reference by the company assembling the board. We typically only add a 3D model.

    Component Outline

    Must match the physical outline of the component. This can be traced from 3D body, if the body is accurate.

    Note

    You must verify the 3D body against the datasheet using the measure tool. We have had multiple instances of people tracing the wrong shape, due to complex models, or even wrong dimensions!

    If this is a legged component, the legs should be disregarded (only trace the plastic/ceramic body)

    Component Center

    A crosshair must be added to all components. This consists of just two lines intersecting to create plus sign.

    The component center should be placed at the center of all component pins.

    The lines should default to 30 mils / 0.8 mm in length. This may be decreased or increased if the component is foolishly smaller or larger than these extents.

    This can be easily found by using “Set Reference” to send the origin to “Center”

    Courtyard

    Collision box for placing components. This is a boundary that should define how much clearance is recommended between components.

    Recommended spacing: 10 mils / 0.25 mm

    Courtyards should be defined from the physical bounds of the component and pads. Silkscreen may be outside the courtyard if desired.

    Pad Guidelines

    Duplicate pads (pads representing the same net) should utilize unique identifiers, and be remapped at the component level. There can be an exception to this for mounting pads, however the trend for Altium seems to be to move fully to unique pad numbers.

    Tolerance data is not necessary for any of our work. It should be left blank.

    Solder mask relief must be set to “Rule.” Exceptions should only be made if a component datasheet requests exact values.

    Through Holes

    Annular ring (the difference between pad radius and hole radius) should be X mils / X mm. Fabricators specify a smaller size which we can use, but we recommend this size for ease of hand solderability.

    Mounting & GND Pads

    If a component requires additional pads that are not regular electrical connections, they must be defined as “GND” or as “MNT” dependent on purpose of the pad. They may be MNT1, MNT2, etc to keep unique identifiers.

    Pin 1 Designation

    Pin one is usually indicated in the datasheet. If not, select the top left or top right corner from the footprint.

    Pin one must be indicated in silkscreen. By default, this should be a circle next to pin one. The circle should be 20 mils / 0.5 mm in diameter.

    This can be achieved using the circle tool with a width of 5 mils / 0.125 mm and radius of 10 mils / 0.25 mm.

    Pin one ideally is also indicated via pads with a rectangular/square pad (with the other pads being ovular/circular). This is most typical in through-hole components.

    3D Model

    All footprints must include a 3D model. If manufacturer CAD is not available, add an extruded model and color it to a representative hue.

    Origin

    All layouts and footprints have an origin. This is where the coordinate system is zeroed from.

    The origin may be moved throughout the layout process but when complete must be set to either the origin of the datasheet dimensions or the center of the component.

    Schematics

    All schematic sheets must use the NER template. Tabloid is the default, but Letter size is also available.

    Info

    These are set via page properties. Click in blank space then open the properties panel. The https://nerdocs.atlassian.net/wiki/spaces/NER/pages/136314883/Schematic+Capture#Schematic-Templates page has further directions if needed.

    Organization & Hierarchy

    Projects requiring multiple sheets should implement a hierarchical structure, utilizing a block-diagram style top sheet.

    ...

    It is preferential to keep a design entirely on the top sheet, if it is small enough.

    Functional sections on all pages should then be designated using medium red dashed lines to define boxes.

    ...

    All schematics must be organized logically. This is typically either by placing in order of power and signal flow (inputs/supplies to the left, to outputs/loads on the right) or, for TS-GLV projects, by organizing according to isolation, placing all isolation barriers along a single line.

    Style Guidelines

    Schematics should default to a 100 mils grid system. The grid may be reduced for placing certain components, but components and wires must be aligned to a 100 mils grid.

    Signal Routing

    Within functional sections of the schematic, it is recommended to utilize wires to establish connections. For longer runs, or within densely connected regions, it is best to use Net Labels. Generally, wire routing just needs to be kept readable, however the designer thinks that is best achieved.

    All connections of significance should be net labeled, even if connected via wire.

    Wires must be stepped away from connections by at least 1 grid spacing (100 mils)

    ...

    Four way connections must be avoided.

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    Net Labels

    Net labels should be used anywhere they make sense, both for connections and for just labeling purposes.

    Net labels should be in full caps with underscores to separate words and suffixes.

    Acronyms may be used if full name would be excessively long. A note should be added to explain acronyms if they are not self explanatory.

    All voltage rails should follow the below guidelines.

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    Power & GND Ports

    All power nets must be implemented using power ports.

    All power nets should be labeled using decimal-less notation. Examples are:

    • +3V3 = Positive 3.3V

    • +1V8 = Positive 1.8V

    • +48V = Positive 48V

    • -5V = Negative 5V

    The BAR power port must be used for all supply voltage nets. This includes positive and negative rails.

    The GND port must be used for all GLV ground/chassis connections.

    The SIGNAL ground port may be used in non-GLV ground systems. This primarily arises in isolated systems.

    Communication Busses

    Bussed signals, such as CAN, SPI, I2C, etc should utilize harnesses.

    ...

    Addressed Devices (I2C)

    Devices with addresses set in hardware must have their address stated above the component in blue text.

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    Component Placement

    Components should be placed on a 100 mils grid.

    Certain parameters should be displayed for every type of component. These may be modified in certain contexts if shown data is completely irrelevant. I.e. resistors used for logic may not need to show power rating.

    If no parameters are shown, the MPN should be shown instead.

    Expand
    titleParameters to display

    Component Type

    Parameters Shown

    Amplifiers

    Audio

    Batteries

    BJTs

    Capacitors

    Chokes

    Clock & Timing

    Comparators

    Connectors

    Crystals & Oscillators

    Custom

    Development Boards

    Diodes

    Embedded

    Fuses

    Gate Drivers

    Hardware

    Heat Sinks

    Inductors

    Integrated Circuits

    Interface

    Isolators

    LED

    Logic

    Memory

    MOSFETs

    Optoisolators

    PMIC

    Potentiometers

    Power Supply

    Relays

    Resistors

    Sensors

    SSRs

    Switches

    Test & Measurement

    Transformers

    TVS Diodes

    Voltage Regulator

    Info

    Altium should be configured to show the correct parameters automatically. Let the Chief EE know if any component types have errors.

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