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Layer Type | Top / Bottom Layer Numbers | Contents |
|---|---|---|
Assembly | 13 / 14 | 3D Model |
Component Outline | 15 / 16 | Outline of physical bounds of package, excluding legs |
Component Center | 17 / 18 | Crosshair at center of component |
Courtyard | 19 / 20 | Clearance required around component / collision box |
Dimensions (OPTIONAL) | 21 / 22 | Additional details component (board edge, insertion direction & clearance, etc) |
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Solder mask relief must be set to “Rule.” Exceptions should only be made if a component datasheet requests exact values.
Plated Through Holes
Annular ring (the difference in radius between pad radius and hole radius) should be 12 mils / 0.3 mm. Fabricators specify a smaller size which we can use, but we recommend this size for ease of hand solderability.
This means you should take hole size (diameter) and add 0.6mm. See https://www.worthingtonassembly.com/plated-thru-hole-size for more.
Given a pin diameter, the hole size should be determined by adding 0.2mm.
Mounting & GND Pads
If a component requires additional pads that are not regular electrical connections, they must be defined as “GND” or as “MNT” dependent on purpose of the pad. They may be MNT1, MNT2, etc to keep unique identifiers.
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