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Footprints

  • Component Centers

    • Where they belong

    • Is it the same for everyone, or stored locally by user?

    • Define a width and length for crosshairs

  • Courtyards

    • Can silkscreen be outside the courtyard?

    • Set specific courtyard distance from component outline

    • Set specific widths for courtyard + component outline

  • Silkscreen/Top Overlay

    • General guidelines for silkscreen markings

    • Pin 1 dot - define radius, thickness, min distance from pads

  • Assembly

    • Would be good to articulate exactly what things are permitted here (some components have boxes/other markings in addition to the 3D model

  • Pads

    • Establish annular ring convention?

    • Should we include tolerance data?

  • Component Outline

    • Make sure it’s clear that the outline doesn’t include the legs of the component

  • How should we handle components which say they’re (for instance) 8-SOIC, but recommend a footprint that’s different from and not encompassed by the existing 8-SOIC footprint?

  • Proper procedure if you can’t find a good 3D model online

  • Guide on how to import footprints from Ultra Librarian/snapEDA/etc.

  • Should define a consistent orientation for footprints (i.e. connectors should face upwards, SOIC packages should have pin 1 at the top left)

Symbols

  • define standard convention for Mechanical pin designators (M? vs. MNT? or similar)

  • Remove Mounting and fiducials and such from BOM

Component Parameters

  • Case/Package vs. Package parameters?

  • Using typical vs min/max columns. Using recommended maximum vs absolute maximum

  • Would be good to add a description to Voltage Rating on connectors to specificy AC or DC

  • It seems like the auto-generated description is nearly always wrong on components, even when part choices is correct. We might want to standardize using the “Detailed Description” from Digikey instead

  • Do we have a standard for what to do if it lists multiple packages?

Component Revision

  • Component States

    • Proper procedure if you review a component then catch an issue

    • If “In production” part has a minor issue, do you bother tweaking it? And if so, do you return it to “in production” or just make it “Reviewed”?

      • If this happens, and a new “reviewed” revision is created, do you have to roll back all prior approved revisions to drafts?

Schematic Guidelines

  • Should we eliminate the units (ohms, Farads) from passives, since its assumed? (i.e. 100n instead of 100nF)

  • Should we go to a standard of using net labels like “3V3” instead of “3.3V” for improved readability?

    • Similarly, we could do “4k7” instead of “4.7kOhms”

  • Should we define standards for use of hierarchical vs. more flat schematic organization?

  • Setting a max of 3 wires per node to improve readability

Layout Guidelines

  • Need to emphasize somewhere that component layer pairs should get added to the PCB file as well

  • Need to emphasize that standard design rules must be added

Design Rules

Design Reviews

  • Need to have all DRC errors resolved before PCB review

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